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Ultra short pulse laser micro machining
In micro machining, ultra-short pulses duration minimizes the heat-affected zone and maximizes the precision of machining. High pulse repetition rate and adequate pulse energy ensure high rate of material removal by ablation.
An impressive progress in picosecond lasers over the last several years made them a reliable tool attractive to the industry. A range of new real-world microprocessing applications became possible only with their arrival. Picosecond or femtosecond pulse duration is comparable with the time of electron-phonon relaxation, and is short enough for “cold” ablation. Effective generation of second, third or even fourth harmonics opens wide opportunities for adaptation of material properties and process nature. Reduced ablation threshold and lower pulse energy create less mechanical and thermal stress on the workpiece.
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In micro machining applications nano, pico and femto second lasers are widely used. From practicality point of view, picosecond lasers have a number of advantages over the yet shorter (femto second) pulse ones. Without the need of pulse stretch and compression for amplification, picosecond lasers are less complicated in their design and thus more cost-effective and reliable, while their pulses are still sufficiently short for very precise and stress-less microprocessing.
Picosecond laser micromachining workstations are capable to directly process a wide range of micron scale features in almost all materials, including:
- Metals
- Semiconductors
- Ceramics
- Polymers
- Composites and resins
- Diamond
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